Place of Origin: | China |
Brand Name: | Ziitek |
Certification: | UL |
Model Number: | TIF120-30-06US thermal pad |
Minimum Order Quantity: | 1000 pcs |
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Price: | 0.1-10 USD/PCS |
Packaging Details: | 25*24*13cm canton |
Delivery Time: | 3-8 work days |
Payment Terms: | T/T |
Supply Ability: | 100000pcs/month |
Hardness: | 18 Shore00 | KEYWORD: | White Silicone Rubber Pads |
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Color: | White | Part Number: | TIF120-30-06US |
Material: | Silicone | Thermal Conductive: | 3.0W/mK |
High Light: | silicone thermal conductive gap pad,memory modules thermal conductive gap pad,silicone thermal pad for cpu |
China company supplied Easy release construction thermal conductive gap pad for Memory Modules ,18 shore00,3.0W/mK
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
<Good thermal conductive
<Moldability for complex parts
<Soft and compressible for low stress applications
<notebook
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
<Automotive electronics
Typical Properties of TIF120-30-06US
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Product Name
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TIF120-30-06US Series |
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Colour
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white | ||
Construction & Compostion
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Ceramic filled silicone elastomer
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Specific gravity |
3.0 g/cc
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Thickness |
0.5mmT
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Hardness
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18 Shore 00
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Dielectric constant@1MHz
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4.0 MHz
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Continuos Use Temp
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-40to 160℃
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Dielectric Breakdown Voltage
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>5500 VAC
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Thermal conductivity
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3.0 W/mK
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Volume Resistiviyt |
1.0*1012 Ohm-cm |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
FAQ
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Contact Person: Miss. Dana
Tel: +86 18153789196